Preforma Uniflex® HW system is a 12 inch tungsten deposition equipment developed by AMEC independently, designed to achieve superior gapfill performance for high aspect ratio and complex structures in semiconductor devices. This system inherits the advantages of previous Preforma Uniflex CW, which can flexibly configure up to 5 dual station process chambers(total 10 stations), each chamber is capable of processing two wafers simultaneously, ensuring lower production cost and chemical consumption while achieving higher production-efficiency. Preforma Uniflexe® HW adopted AMEC proprietary gradient tungsten growth inhibition process technology, in addition with AMEC developed control system, can precisely control the inhibition process from millisecond level to thousands of seconds, being able to meet gapfil requirements for various kinds of challenging structures. Together with optimized flow and thermal field design, this equipment delivers goodfilm uniformity and process tuning flexibility.
Preforma Uniflex® HW system is a 12 inch tungsten deposition equipment developed by AMEC independently
Dual-station chamber and system with up to five dual-station chambers configuration
Isolated and compact reaction region
Effective and flexible process tuning window
AMEC proprietary precisely controlled growth inhibition process technology
AMEC-designed heater with vacuum chuck.
High productivity, low cost and chemical consumption
Excellent film uniformity and process stability
Excellent high aspect ratio structure gapfill capability and good compatibility for different complex structures
Good process handling capability for high-bow wafer
